Manufacturer profile

Samsung Electronics distributor & excess inventory

Hybrid Electronics sources Samsung Semiconductor DDR5 / DDR4 DRAM modules and components, LPDDR5X / LPDDR4X mobile and automotive DRAM, HBM2E / HBM3 high-bandwidth memory, 3D V-NAND raw flash, eMMC 5.1 and UFS 3.1 / 4.0 managed NAND, 980 / 990 PRO and PM-series enterprise NVMe SSDs, Exynos SoCs, and ISOCELL image sensors — plus Samsung Electro-Mechanics (SEMCO) MLCC, power inductors, ferrite beads, and RF modules. From current-production DDR5 RDIMM to obsolete K4T DDR2 and K9F planar NAND for locked-BOM systems, we quote same-day from OEM excess and traceable secondary channels since 1995.

#1
Memory maker worldwide
Since 1969
Semi div founded
SEMCO
MLCC & power inductors
Same-day
Quote turnaround

About Samsung Electronics

Samsung Electronics Co., Ltd., founded in 1969 and headquartered in Suwon, South Korea (with the broader Samsung Group tracing back to 1938), is the world's largest producer of DRAM and NAND flash memory and one of the two flagship pure-play / IDM foundry operators. The Samsung Semiconductor division spans the full memory and logic stack: DDR5 and DDR4 DRAM components and modules under the M321 / M323 / M329 / M378 / M393 / M474 module prefixes, LPDDR5X / LPDDR4X mobile DRAM under the K3LK / K3RG / K4F / K4H prefixes, HBM2E / HBM3 stacks (K4ZAF family), 3D V-NAND raw flash (K9CJG, K9HFG), eMMC 5.1 (KLM family) and UFS 3.1 / 4.0 (KLU family) managed NAND, 980 / 990 PRO consumer NVMe SSDs (MZ-V7S, MZ-V8V, MZ-V9P) and PM9A3 / PM1735 enterprise NVMe, Exynos application processors, ISOCELL CMOS image sensors, and S25FL / S70FL serial NOR flash. The sister company Samsung Electro-Mechanics (SEMCO) is one of the world's top-three MLCC makers and a scale supplier of chip inductors (CIG shielded power, CIM multilayer, CIH high-current), ferrite beads (CBM), chip antennas, and RF / camera modules. Samsung Electronics employs roughly 270,000 people worldwide.

Hybrid Electronics has stocked and sourced legacy and excess Samsung product since we began in 1995. We support customers who need obsolete DDR2 K4T and DDR3 K4B SDRAM for long-lifecycle industrial and defense systems, K9F / K9G / K9K SLC and MLC planar NAND pre-3D V-NAND for embedded boot storage, discontinued Exynos 5, 7, 8895, 9820, 990 SoCs and legacy S5PC / S5P Cortex-A9 application processors for aftermarket and repair channels, obsolete ISOCELL S5K4E and S5K2P image sensors, and SEMCO MLCC Q-series AEC-Q200 and high-voltage capacitors when authorized channels show zero stock or 30+ week lead times. Where OEMs allocate current-generation Samsung memory to hyperscale AI customers, our OEM-excess and CEM-surplus channels remain a reliable secondary source.

Samsung product families we source

Our line card covers both Samsung Semiconductor (memory, storage, logic, sensors) and Samsung Electro-Mechanics / SEMCO (MLCC, inductors, RF modules) — from HBM3 stacks shipping into next-generation AI accelerators to legacy K4T DDR2 SDRAM and K9F planar NAND keeping industrial, medical, and defense systems in service.

DDR5 DRAM modules — UDIMM / SODIMM / RDIMM

DDR5 UDIMM (M321R family), DDR5 SODIMM (M425R / M323R family), and DDR5 RDIMM / MRDIMM (M321R, M329R, M321RxGA server) at 4800 / 5600 / 6400 MT/s speeds, 8GB through 256GB densities for AMD EPYC 9004 / 9005 and Intel Xeon 5th / 6th Gen platforms.

DDR4 DRAM modules — UDIMM / SODIMM / RDIMM

M378 unbuffered DIMM, M474 SODIMM, and M393 registered DIMM / LRDIMM server modules at 2133 / 2400 / 2666 / 2933 / 3200 MT/s, ECC and non-ECC, 4GB through 128GB. Broad coverage for server refresh, industrial, embedded, and workstation builds.

DDR5 / DDR4 DRAM components

K4A DDR4 SDRAM components (4Gb / 8Gb / 16Gb x4 / x8 / x16 at 2133–3200 MT/s) and K4Z DDR5 SDRAM (8Gb / 16Gb / 24Gb / 32Gb x4 / x8 / x16 up to 6400 MT/s) for board-level design-in and industrial-temp builds.

LPDDR5 / LPDDR5X / LPDDR4X mobile DRAM

K3LK LPDDR5 / LPDDR5X (6400 / 7500 / 8533 Mb/s), K3RG LPDDR4X, K4F LPDDR4, and legacy K4H LPDDR4 mobile DRAM in 4GB, 6GB, 8GB, 12GB, 16GB, 24GB packages. Commercial, industrial, and automotive-adjacent grades for smartphones, tablets, ADAS, cockpit compute, and 5G baseband.

HBM2E / HBM3 High-Bandwidth Memory

Samsung K4ZAF-family HBM stacks including HBM2E and HBM3 8Gb / 16Gb-per-die 8-high and 12-high configurations delivering 3.2 – 6.4 Gb/s data rate per pin. Design-in and channel support for AI accelerator, HPC, and networking customers.

3D V-NAND raw flash

K9CJG / K9HFG 3D V-NAND (V6 / V7 / V8 128L / 176L / 236L TLC and QLC), plus legacy K9F / K9G / K9K planar SLC and MLC NAND (1Gb, 2Gb, 4Gb, 8Gb, 16Gb, 32Gb) still specified into industrial and defense storage designs.

eMMC 5.1 managed NAND (KLM series)

Samsung KLM-prefix eMMC 5.1 devices from 4GB through 256GB (KLM4G1FETE, KLM8G1GETF, KLMBG2JETD, KLMDG4UCTA, etc.) in 153-ball VFBGA, commercial and industrial temp, for embedded, IoT, and cost-sensitive smartphone / tablet builds.

UFS 3.1 / 4.0 managed NAND (KLU series)

Samsung KLU-prefix UFS 3.1 and UFS 4.0 managed storage (KLUEG8UHDB, KLUFG8RHDA, etc.) from 128GB to 1TB, 153-ball BGA. High-end smartphone, automotive infotainment, and next-generation embedded storage.

Consumer NVMe SSDs — 980 / 990 series

Samsung MZ-V7S (970 EVO / EVO Plus), MZ-V8V (980 / 980 PRO), and MZ-V9P (990 PRO / 990 EVO) M.2 2280 NVMe SSDs at 250GB, 500GB, 1TB, 2TB, and 4TB capacities. PCIe Gen3 / Gen4 for client desktop, workstation, and gaming refresh.

Enterprise & Data-Center NVMe SSDs (PM series)

Samsung PM9A3 (PCIe Gen4 U.2 / M.2 / E1.S read-intensive datacenter, 960GB – 15.36TB), PM1735 (PCIe Gen4 HHHL / U.2 mixed-use, up to 12.8TB), and legacy PM1725 / PM1633 / PM863 for hyperscaler refresh and locked-BOM storage tenders.

Serial NOR flash — S25FL / S70FL

S25FL and S70FL SPI serial NOR flash (formerly Spansion / Cypress, now under Infineon / Samsung foundry) for FPGA configuration, MCU boot, and embedded firmware storage. Densities 4Mb through 2Gb, 8-SOIC, WSON, BGA.

Exynos application processors

Samsung Exynos 2200 (4nm, AMD RDNA2 GPU), Exynos 990 (7nm, Galaxy S20), Exynos 9820 / 9825 (Galaxy S10 / Note 10), Exynos 8895 (Galaxy S8), and older Exynos 5 / 7 series SoCs and legacy S5P / S5PC Cortex-A9 application processors for aftermarket / repair channel and industrial single-board computers.

ISOCELL CMOS image sensors

Samsung ISOCELL image sensors including S5KHM1 (108MP HM1), S5KGN2 (50MP GN2), S5K2L4 (12MP), S5K3L6 (13MP), S5K3P3 (16MP), and legacy S5K4E / S5K2P for smartphone, tablet, dashcam, and industrial vision applications.

SEMCO MLCC — CL series (0201 through 1210)

Samsung Electro-Mechanics CL05, CL10, CL21, CL31, CL32 MLCC in 0402, 0603, 0805, 1206, 1210 case sizes. Full dielectric coverage: X5R / X7R / X8R (mid-K), C0G / NP0 (low-loss), Y5V (high-cap consumer). SEMCO is one of the top-three MLCC producers worldwide.

SEMCO automotive & high-voltage MLCC

Q-series AEC-Q200 automotive MLCC (CL21 Q, CL31 Q auto) for infotainment, ADAS, powertrain, and BMS, plus high-voltage (25V, 50V, 100V, 250V, 500V, 1kV, 2kV, 3kV) MLCC for LED drivers, industrial power, and EV traction. High-Q RF MLCC for 5G small-cell and Wi-Fi 6 / 7 front-ends.

SEMCO chip inductors & ferrite beads

CIG shielded metal-composite power inductors (0402 through 1008), CIM multilayer chip inductors, CIH high-current wire-wound power inductors, and CBM series ferrite beads for EMI suppression. Alternate for TDK MPZ / Murata BLM / TDK MLZ decoupling networks.

SEMCO RF modules & chip antennas

Samsung Electro-Mechanics Wi-Fi / Bluetooth chip antenna modules, RF front-end modules, and integrated wireless modules used in smartphone, IoT, and industrial wireless designs.

Notable Samsung part numbers we track

Hybrid Electronics quotes and sources the following Samsung parts across DRAM modules, DRAM components, LPDDRx mobile DRAM, HBM, 3D V-NAND, managed NAND, NVMe SSDs, image sensors, SoCs, and Samsung Electro-Mechanics passives. Samsung Semiconductor uses M321 / M323 / M329 / M378 / M393 / M474 for DRAM modules, K4 for DRAM silicon, K3 for LPDDRx, K9 for NAND, KLM for eMMC, KLU for UFS, MZ-V for consumer SSDs, PM for enterprise SSDs, and S5K for ISOCELL sensors. Samsung Electro-Mechanics uses CL for MLCC, CIG / CIM / CIH for inductors, and CBM for ferrite beads — contact us for the exact revision, temp grade, and case size you need.

Part number Family Description Quote
M321R2GA3BB6-CQKDDR5 RDIMM16GB DDR5-4800 RDIMM ECC 1Rx8 serverQuote
M321R4GA3BB6-CQKDDR5 RDIMM32GB DDR5-4800 RDIMM ECC 2Rx8 serverQuote
M321R8GA0BB0-CQKDDR5 RDIMM64GB DDR5-4800 RDIMM ECC 2Rx4 serverQuote
M329R8GA0BB0-CQKDDR5 RDIMM64GB DDR5-4800 RDIMM ECC dual-rankQuote
M321R8GA0PB0-CWMDDR5 RDIMM64GB DDR5-5600 RDIMM ECC 2Rx4Quote
M321RAGA0PB0-CWMDDR5 RDIMM128GB DDR5-5600 RDIMM ECC 2Rx4Quote
M323R2GA3BB0-CQKDDR5 SODIMM16GB DDR5-4800 SODIMM 1Rx8 laptop / workstationQuote
M323R4GA3BB0-CQKDDR5 SODIMM32GB DDR5-4800 SODIMM 2Rx8 laptop / workstationQuote
M321R2GA3PB0-CWMDDR5 UDIMM16GB DDR5-5600 UDIMM 1Rx8 desktopQuote
M378A1K43CB2-CTDDDR4 UDIMM8GB DDR4-2666 UDIMM 1Rx8 non-ECC desktopQuote
M378A2K43CB1-CRCDDR4 UDIMM16GB DDR4-2400 UDIMM 2Rx8 non-ECC desktopQuote
M378A4G43AB2-CWEDDR4 UDIMM32GB DDR4-3200 UDIMM 2Rx8 non-ECC desktopQuote
M474A1K43CB1-CRCDDR4 SODIMM8GB DDR4-2400 SODIMM 1Rx8 laptopQuote
M474A2K43CB1-CTDDDR4 SODIMM16GB DDR4-2666 SODIMM 2Rx8 laptopQuote
M474A4G43AB1-CWEDDR4 SODIMM32GB DDR4-3200 SODIMM 2Rx8 laptopQuote
M393A2K43DB3-CWEDDR4 RDIMM16GB DDR4-3200 RDIMM ECC 1Rx8 serverQuote
M393A4K40EB3-CWEDDR4 RDIMM32GB DDR4-3200 RDIMM ECC 2Rx4 serverQuote
M393A8G40BB4-CWEDDR4 RDIMM64GB DDR4-3200 RDIMM ECC 2Rx4 serverQuote
M393AAG40M32-CAEDDR4 LRDIMM128GB DDR4-3200 LRDIMM ECC 4Rx4 serverQuote
K4A8G085WC-BCTDDDR4 SDRAM8Gb DDR4 x8 2666 MT/s component, 78-FBGAQuote
K4AAG085WA-BCWEDDR4 SDRAM16Gb DDR4 x8 3200 MT/s componentQuote
K4A4G165WF-BCTDDDR4 SDRAM4Gb DDR4 x16 2666 MT/s componentQuote
K4Z80325BC-HC14GDDR616Gb GDDR6 SGRAM 14 Gb/s for GPU / networkingQuote
K4ZAF325BM-HC16HBM2E16Gb HBM2E die 3.2 Gb/s stacked memoryQuote
K3LK7K70BM-BGCPLPDDR596Gb LPDDR5 6400 Mb/s multichip mobileQuote
K3LKBKB0BM-MGCPLPDDR5X128Gb LPDDR5X 8533 Mb/s mobile PoPQuote
K3RG5G50MM-MGCJLPDDR4X48Gb LPDDR4X 4266 Mb/s mobile PoPQuote
K3RG6G60MM-MGCJLPDDR4X96Gb LPDDR4X 4266 Mb/s mobile PoPQuote
K4F6E304HM-MGCJLPDDR432Gb LPDDR4 3200 Mb/s discreteQuote
K4FBE3D4HM-MGCLLPDDR4X64Gb LPDDR4X 4266 Mb/s discreteQuote
K9CJG8U0M-CCK03D V-NAND512Gb 3D V-NAND TLC raw flashQuote
K9HFG08U1D-SIB03D V-NAND1Tb 3D V-NAND TLC raw flash, x8 asyncQuote
K9F1G08U0F-PCB0SLC NAND1Gb SLC NAND parallel, 3.3V, 48-TSOP — legacyQuote
K9F4G08U0F-SCB0SLC NAND4Gb SLC NAND parallel, 3.3V, 48-TSOP — legacyQuote
K9GAG08U0M-PCB0MLC NAND16Gb MLC NAND parallel — legacy planarQuote
KLM4G1FETE-B041eMMC 5.132Gb (4GB) eMMC 5.1 153-VFBGAQuote
KLM8G1GETF-B041eMMC 5.164Gb (8GB) eMMC 5.1 153-VFBGAQuote
KLMBG2JETD-B041eMMC 5.1256Gb (32GB) eMMC 5.1 153-VFBGAQuote
KLMDG4UCTA-B041eMMC 5.11Tb (128GB) eMMC 5.1 153-VFBGAQuote
KLUEG8UHDB-C2D1UFS 3.1256GB UFS 3.1 managed NAND 153-BGAQuote
KLUFG8RHDA-B2D1UFS 3.1512GB UFS 3.1 managed NAND 153-BGAQuote
MZ-V7S1T0B/AM970 EVO Plus1TB PCIe Gen3 NVMe M.2 2280 consumer SSDQuote
MZ-V8V1T0B/AM980 SSD1TB PCIe Gen3 NVMe M.2 2280 consumer SSDQuote
MZ-V8P2T0B/AM980 PRO2TB PCIe Gen4 NVMe M.2 2280 consumer SSDQuote
MZ-V9P2T0B/AM990 PRO2TB PCIe Gen4 NVMe M.2 2280 consumer SSDQuote
MZ-V9P4T0B/AM990 PRO4TB PCIe Gen4 NVMe M.2 2280 consumer SSDQuote
MZQL23T8HCLS-00A07PM9A33.84TB PCIe Gen4 NVMe U.2 datacenter, read-intensiveQuote
MZQL27T6HBLA-00A07PM9A37.68TB PCIe Gen4 NVMe U.2 datacenterQuote
MZPLJ1T6HBJR-00007PM17351.6TB PCIe Gen4 HHHL mixed-use datacenter SSDQuote
S25FL128SAGMFI001NOR flash128Mb SPI serial NOR flash, 3V, 16-SOICQuote
S70FL01GSAGMFV011NOR flash1Gb SPI serial NOR flash for FPGA configQuote
S5KHM1SP03ISOCELL HM1108MP CMOS image sensor, 1/1.33-inchQuote
S5KGN2XX03ISOCELL GN250MP CMOS image sensor, 1/1.12-inch dual-pixelQuote
S5K3L6XX03ISOCELL13MP CMOS image sensor, 1/3.1-inchQuote
S5K2L4ISOCELL12MP CMOS image sensor, 1/2.55-inch dual-pixelQuote
CL10B104KB8NNNCSEMCO MLCC0603 X7R 100nF 50V 10% MLCCQuote
CL21B106KOQNNNESEMCO MLCC0805 X7R 10uF 16V 10% high-cap MLCCQuote
CL31A226KAHNNNESEMCO MLCC1206 X5R 22uF 25V 10% high-cap MLCCQuote
CL05C100JB5NNNCSEMCO MLCC0402 C0G/NP0 10pF 50V 5% RF MLCCQuote
CL21B105KBFNFNESEMCO Auto MLCC0805 X7R 1uF 50V AEC-Q200 automotive MLCCQuote
CIGT201210LM2R2MNESEMCO Inductor0805 shielded metal-composite 2.2uH power inductorQuote
CIH10P4N7SNCSEMCO Inductor0603 high-current wire-wound 4.7nH RF inductorQuote
CBM322516HR300TSEMCO Ferrite1210 30-ohm 3A ferrite bead EMI suppressionQuote

Current-production Samsung HBM3 / HBM3E 12-high stacks, DDR5 MRDIMM, CXL memory expander modules, 236-layer V-NAND, next-generation Exynos SoCs, and additional temp / speed / density variants across DDR4, DDR5, LPDDR5X, and V-NAND also quoted on request. Regional revision codes and rev-locked material available — export-controlled advanced NAND and HBM subject to EAR screening.

Obsolete & hard-to-find Samsung parts

Memory, storage, and SoC roadmaps at Samsung move quickly — components typically leave authorized distribution 2–3 years after a new process node ramps. Industrial control, medical imaging, defense electronics, avionics, and aftermarket repair channels often need continued access to legacy Samsung silicon and Samsung Electro-Mechanics passives. Hybrid Electronics sources these end-of-life Samsung products from OEM excess, contract-manufacturer surplus, and traceable secondary channels:

Send an RFQ with quantity, target date code range, and any traceability requirements (COO, MSL, factory sealed, DPAS-rated) — we return same-day availability from stock or an ETA from our sourcing network.

Samsung quote & sourcing FAQ

What Samsung products does Hybrid Electronics quote most often?

DDR4 and DDR5 RDIMMs (M393, M321R, M329R) for server refresh, LPDDR4X / LPDDR5 mobile DRAM (K3RG, K3LK) for embedded and industrial designs, Samsung PM9A3 and PM1735 enterprise NVMe SSDs, and 980 / 990 PRO consumer SSDs are our highest-volume Samsung quote categories. Legacy DDR3 K4B, obsolete K9F SLC NAND, discontinued Exynos SoCs, and SEMCO CL-series MLCC (including AEC-Q200 automotive Q-series) are steady low-volume sourcing lines for medical, defense, industrial, and automotive customers.

Can Hybrid Electronics source Samsung HBM2E / HBM3 for AI accelerator programs?

Yes — on an inquiry basis. Samsung K4ZAF-family HBM2E and HBM3 8-high and 12-high stack allocation is tight and priced dynamically, so we quote per-unit on demand against real-time supply from OEM excess and channel partners rather than holding stock. Include your target quantity, target AI accelerator platform, and required Samsung revision, and we will return an availability window and quoted price.

Do you carry Samsung Electro-Mechanics (SEMCO) MLCC, inductors, and RF modules?

Yes. Samsung Electro-Mechanics is a separate Samsung Group company that operates as one of the top-three MLCC suppliers worldwide. We source SEMCO CL05, CL10, CL21, CL31, CL32 MLCC in X5R / X7R / X8R / C0G dielectrics and 0201 through 1210 case sizes, Q-series AEC-Q200 automotive MLCC, high-voltage MLCC up to 3kV, CIG / CIM / CIH power and RF inductors, CBM ferrite beads, and Wi-Fi / Bluetooth chip antenna and RF modules.

Do you carry industrial-temperature and AEC-Q100 / AEC-Q200 automotive Samsung parts?

Yes. We regularly source Samsung DRAM and NAND in industrial (IT / WT) and AEC-Q100 automotive grades, plus SEMCO Q-series AEC-Q200 MLCC and passives for infotainment, ADAS, powertrain, and BMS. Ask us to match a specific temp grade, revision, or date code range on your RFQ.

Are your legacy Samsung parts factory sealed and traceable?

Yes when available — most of our OEM-excess and CEM-surplus Samsung stock is factory sealed with original date codes and full traceability documentation. For downgraded stock we disclose condition (open tray, tested-pull, refurbished) on the quote. Customers requiring MSL data, COO, or DPAS-rated delivery should note that on the RFQ.

How fast is your Samsung quote turnaround?

Same day for parts in stock — typically within 2 hours during business hours (9am–6pm ET). Sourced quotes on out-of-stock parts return within 24–48 hours with an availability window. Email sales@hybridelectronics.com or call (407) 542-3995 to open an RFQ.

Is Hybrid Electronics an authorized Samsung distributor?

No — we're an independent distributor and excess-inventory buyer sourcing from OEM excess, CEM surplus, and traceable secondary channels since 1995. For factory-warranted current-production orders, work with a Samsung-authorized distributor. For obsolete, hard-to-find, industrial-temp, or allocated Samsung Semiconductor and Samsung Electro-Mechanics parts where authorized channels show no stock, Hybrid Electronics is a proven independent source.

NEED SAMSUNG?

Send us your Samsung RFQ — part number, quantity, target date code — and we'll come back same day with availability from stock or an ETA from our sourcing network.

Or call (407) 542-3995

Same-day Samsung quotes

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Hybrid Electronics is an independent distributor — not an authorized Samsung Electronics distributor. All trademarks belong to Samsung Electronics Co., Ltd. and Samsung Electro-Mechanics Co., Ltd.