Manufacturer profile
Hybrid Electronics sources Samsung Semiconductor DDR5 / DDR4 DRAM modules and components, LPDDR5X / LPDDR4X mobile and automotive DRAM, HBM2E / HBM3 high-bandwidth memory, 3D V-NAND raw flash, eMMC 5.1 and UFS 3.1 / 4.0 managed NAND, 980 / 990 PRO and PM-series enterprise NVMe SSDs, Exynos SoCs, and ISOCELL image sensors — plus Samsung Electro-Mechanics (SEMCO) MLCC, power inductors, ferrite beads, and RF modules. From current-production DDR5 RDIMM to obsolete K4T DDR2 and K9F planar NAND for locked-BOM systems, we quote same-day from OEM excess and traceable secondary channels since 1995.
Samsung Electronics Co., Ltd., founded in 1969 and headquartered in Suwon, South Korea (with the broader Samsung Group tracing back to 1938), is the world's largest producer of DRAM and NAND flash memory and one of the two flagship pure-play / IDM foundry operators. The Samsung Semiconductor division spans the full memory and logic stack: DDR5 and DDR4 DRAM components and modules under the M321 / M323 / M329 / M378 / M393 / M474 module prefixes, LPDDR5X / LPDDR4X mobile DRAM under the K3LK / K3RG / K4F / K4H prefixes, HBM2E / HBM3 stacks (K4ZAF family), 3D V-NAND raw flash (K9CJG, K9HFG), eMMC 5.1 (KLM family) and UFS 3.1 / 4.0 (KLU family) managed NAND, 980 / 990 PRO consumer NVMe SSDs (MZ-V7S, MZ-V8V, MZ-V9P) and PM9A3 / PM1735 enterprise NVMe, Exynos application processors, ISOCELL CMOS image sensors, and S25FL / S70FL serial NOR flash. The sister company Samsung Electro-Mechanics (SEMCO) is one of the world's top-three MLCC makers and a scale supplier of chip inductors (CIG shielded power, CIM multilayer, CIH high-current), ferrite beads (CBM), chip antennas, and RF / camera modules. Samsung Electronics employs roughly 270,000 people worldwide.
Hybrid Electronics has stocked and sourced legacy and excess Samsung product since we began in 1995. We support customers who need obsolete DDR2 K4T and DDR3 K4B SDRAM for long-lifecycle industrial and defense systems, K9F / K9G / K9K SLC and MLC planar NAND pre-3D V-NAND for embedded boot storage, discontinued Exynos 5, 7, 8895, 9820, 990 SoCs and legacy S5PC / S5P Cortex-A9 application processors for aftermarket and repair channels, obsolete ISOCELL S5K4E and S5K2P image sensors, and SEMCO MLCC Q-series AEC-Q200 and high-voltage capacitors when authorized channels show zero stock or 30+ week lead times. Where OEMs allocate current-generation Samsung memory to hyperscale AI customers, our OEM-excess and CEM-surplus channels remain a reliable secondary source.
Our line card covers both Samsung Semiconductor (memory, storage, logic, sensors) and Samsung Electro-Mechanics / SEMCO (MLCC, inductors, RF modules) — from HBM3 stacks shipping into next-generation AI accelerators to legacy K4T DDR2 SDRAM and K9F planar NAND keeping industrial, medical, and defense systems in service.
DDR5 UDIMM (M321R family), DDR5 SODIMM (M425R / M323R family), and DDR5 RDIMM / MRDIMM (M321R, M329R, M321RxGA server) at 4800 / 5600 / 6400 MT/s speeds, 8GB through 256GB densities for AMD EPYC 9004 / 9005 and Intel Xeon 5th / 6th Gen platforms.
M378 unbuffered DIMM, M474 SODIMM, and M393 registered DIMM / LRDIMM server modules at 2133 / 2400 / 2666 / 2933 / 3200 MT/s, ECC and non-ECC, 4GB through 128GB. Broad coverage for server refresh, industrial, embedded, and workstation builds.
K4A DDR4 SDRAM components (4Gb / 8Gb / 16Gb x4 / x8 / x16 at 2133–3200 MT/s) and K4Z DDR5 SDRAM (8Gb / 16Gb / 24Gb / 32Gb x4 / x8 / x16 up to 6400 MT/s) for board-level design-in and industrial-temp builds.
K3LK LPDDR5 / LPDDR5X (6400 / 7500 / 8533 Mb/s), K3RG LPDDR4X, K4F LPDDR4, and legacy K4H LPDDR4 mobile DRAM in 4GB, 6GB, 8GB, 12GB, 16GB, 24GB packages. Commercial, industrial, and automotive-adjacent grades for smartphones, tablets, ADAS, cockpit compute, and 5G baseband.
Samsung K4ZAF-family HBM stacks including HBM2E and HBM3 8Gb / 16Gb-per-die 8-high and 12-high configurations delivering 3.2 – 6.4 Gb/s data rate per pin. Design-in and channel support for AI accelerator, HPC, and networking customers.
K9CJG / K9HFG 3D V-NAND (V6 / V7 / V8 128L / 176L / 236L TLC and QLC), plus legacy K9F / K9G / K9K planar SLC and MLC NAND (1Gb, 2Gb, 4Gb, 8Gb, 16Gb, 32Gb) still specified into industrial and defense storage designs.
Samsung KLM-prefix eMMC 5.1 devices from 4GB through 256GB (KLM4G1FETE, KLM8G1GETF, KLMBG2JETD, KLMDG4UCTA, etc.) in 153-ball VFBGA, commercial and industrial temp, for embedded, IoT, and cost-sensitive smartphone / tablet builds.
Samsung KLU-prefix UFS 3.1 and UFS 4.0 managed storage (KLUEG8UHDB, KLUFG8RHDA, etc.) from 128GB to 1TB, 153-ball BGA. High-end smartphone, automotive infotainment, and next-generation embedded storage.
Samsung MZ-V7S (970 EVO / EVO Plus), MZ-V8V (980 / 980 PRO), and MZ-V9P (990 PRO / 990 EVO) M.2 2280 NVMe SSDs at 250GB, 500GB, 1TB, 2TB, and 4TB capacities. PCIe Gen3 / Gen4 for client desktop, workstation, and gaming refresh.
Samsung PM9A3 (PCIe Gen4 U.2 / M.2 / E1.S read-intensive datacenter, 960GB – 15.36TB), PM1735 (PCIe Gen4 HHHL / U.2 mixed-use, up to 12.8TB), and legacy PM1725 / PM1633 / PM863 for hyperscaler refresh and locked-BOM storage tenders.
S25FL and S70FL SPI serial NOR flash (formerly Spansion / Cypress, now under Infineon / Samsung foundry) for FPGA configuration, MCU boot, and embedded firmware storage. Densities 4Mb through 2Gb, 8-SOIC, WSON, BGA.
Samsung Exynos 2200 (4nm, AMD RDNA2 GPU), Exynos 990 (7nm, Galaxy S20), Exynos 9820 / 9825 (Galaxy S10 / Note 10), Exynos 8895 (Galaxy S8), and older Exynos 5 / 7 series SoCs and legacy S5P / S5PC Cortex-A9 application processors for aftermarket / repair channel and industrial single-board computers.
Samsung ISOCELL image sensors including S5KHM1 (108MP HM1), S5KGN2 (50MP GN2), S5K2L4 (12MP), S5K3L6 (13MP), S5K3P3 (16MP), and legacy S5K4E / S5K2P for smartphone, tablet, dashcam, and industrial vision applications.
Samsung Electro-Mechanics CL05, CL10, CL21, CL31, CL32 MLCC in 0402, 0603, 0805, 1206, 1210 case sizes. Full dielectric coverage: X5R / X7R / X8R (mid-K), C0G / NP0 (low-loss), Y5V (high-cap consumer). SEMCO is one of the top-three MLCC producers worldwide.
Q-series AEC-Q200 automotive MLCC (CL21 Q, CL31 Q auto) for infotainment, ADAS, powertrain, and BMS, plus high-voltage (25V, 50V, 100V, 250V, 500V, 1kV, 2kV, 3kV) MLCC for LED drivers, industrial power, and EV traction. High-Q RF MLCC for 5G small-cell and Wi-Fi 6 / 7 front-ends.
CIG shielded metal-composite power inductors (0402 through 1008), CIM multilayer chip inductors, CIH high-current wire-wound power inductors, and CBM series ferrite beads for EMI suppression. Alternate for TDK MPZ / Murata BLM / TDK MLZ decoupling networks.
Samsung Electro-Mechanics Wi-Fi / Bluetooth chip antenna modules, RF front-end modules, and integrated wireless modules used in smartphone, IoT, and industrial wireless designs.
Hybrid Electronics quotes and sources the following Samsung parts across DRAM modules, DRAM components, LPDDRx mobile DRAM, HBM, 3D V-NAND, managed NAND, NVMe SSDs, image sensors, SoCs, and Samsung Electro-Mechanics passives. Samsung Semiconductor uses M321 / M323 / M329 / M378 / M393 / M474 for DRAM modules, K4 for DRAM silicon, K3 for LPDDRx, K9 for NAND, KLM for eMMC, KLU for UFS, MZ-V for consumer SSDs, PM for enterprise SSDs, and S5K for ISOCELL sensors. Samsung Electro-Mechanics uses CL for MLCC, CIG / CIM / CIH for inductors, and CBM for ferrite beads — contact us for the exact revision, temp grade, and case size you need.
| Part number | Family | Description | Quote |
|---|---|---|---|
| M321R2GA3BB6-CQK | DDR5 RDIMM | 16GB DDR5-4800 RDIMM ECC 1Rx8 server | Quote |
| M321R4GA3BB6-CQK | DDR5 RDIMM | 32GB DDR5-4800 RDIMM ECC 2Rx8 server | Quote |
| M321R8GA0BB0-CQK | DDR5 RDIMM | 64GB DDR5-4800 RDIMM ECC 2Rx4 server | Quote |
| M329R8GA0BB0-CQK | DDR5 RDIMM | 64GB DDR5-4800 RDIMM ECC dual-rank | Quote |
| M321R8GA0PB0-CWM | DDR5 RDIMM | 64GB DDR5-5600 RDIMM ECC 2Rx4 | Quote |
| M321RAGA0PB0-CWM | DDR5 RDIMM | 128GB DDR5-5600 RDIMM ECC 2Rx4 | Quote |
| M323R2GA3BB0-CQK | DDR5 SODIMM | 16GB DDR5-4800 SODIMM 1Rx8 laptop / workstation | Quote |
| M323R4GA3BB0-CQK | DDR5 SODIMM | 32GB DDR5-4800 SODIMM 2Rx8 laptop / workstation | Quote |
| M321R2GA3PB0-CWM | DDR5 UDIMM | 16GB DDR5-5600 UDIMM 1Rx8 desktop | Quote |
| M378A1K43CB2-CTD | DDR4 UDIMM | 8GB DDR4-2666 UDIMM 1Rx8 non-ECC desktop | Quote |
| M378A2K43CB1-CRC | DDR4 UDIMM | 16GB DDR4-2400 UDIMM 2Rx8 non-ECC desktop | Quote |
| M378A4G43AB2-CWE | DDR4 UDIMM | 32GB DDR4-3200 UDIMM 2Rx8 non-ECC desktop | Quote |
| M474A1K43CB1-CRC | DDR4 SODIMM | 8GB DDR4-2400 SODIMM 1Rx8 laptop | Quote |
| M474A2K43CB1-CTD | DDR4 SODIMM | 16GB DDR4-2666 SODIMM 2Rx8 laptop | Quote |
| M474A4G43AB1-CWE | DDR4 SODIMM | 32GB DDR4-3200 SODIMM 2Rx8 laptop | Quote |
| M393A2K43DB3-CWE | DDR4 RDIMM | 16GB DDR4-3200 RDIMM ECC 1Rx8 server | Quote |
| M393A4K40EB3-CWE | DDR4 RDIMM | 32GB DDR4-3200 RDIMM ECC 2Rx4 server | Quote |
| M393A8G40BB4-CWE | DDR4 RDIMM | 64GB DDR4-3200 RDIMM ECC 2Rx4 server | Quote |
| M393AAG40M32-CAE | DDR4 LRDIMM | 128GB DDR4-3200 LRDIMM ECC 4Rx4 server | Quote |
| K4A8G085WC-BCTD | DDR4 SDRAM | 8Gb DDR4 x8 2666 MT/s component, 78-FBGA | Quote |
| K4AAG085WA-BCWE | DDR4 SDRAM | 16Gb DDR4 x8 3200 MT/s component | Quote |
| K4A4G165WF-BCTD | DDR4 SDRAM | 4Gb DDR4 x16 2666 MT/s component | Quote |
| K4Z80325BC-HC14 | GDDR6 | 16Gb GDDR6 SGRAM 14 Gb/s for GPU / networking | Quote |
| K4ZAF325BM-HC16 | HBM2E | 16Gb HBM2E die 3.2 Gb/s stacked memory | Quote |
| K3LK7K70BM-BGCP | LPDDR5 | 96Gb LPDDR5 6400 Mb/s multichip mobile | Quote |
| K3LKBKB0BM-MGCP | LPDDR5X | 128Gb LPDDR5X 8533 Mb/s mobile PoP | Quote |
| K3RG5G50MM-MGCJ | LPDDR4X | 48Gb LPDDR4X 4266 Mb/s mobile PoP | Quote |
| K3RG6G60MM-MGCJ | LPDDR4X | 96Gb LPDDR4X 4266 Mb/s mobile PoP | Quote |
| K4F6E304HM-MGCJ | LPDDR4 | 32Gb LPDDR4 3200 Mb/s discrete | Quote |
| K4FBE3D4HM-MGCL | LPDDR4X | 64Gb LPDDR4X 4266 Mb/s discrete | Quote |
| K9CJG8U0M-CCK0 | 3D V-NAND | 512Gb 3D V-NAND TLC raw flash | Quote |
| K9HFG08U1D-SIB0 | 3D V-NAND | 1Tb 3D V-NAND TLC raw flash, x8 async | Quote |
| K9F1G08U0F-PCB0 | SLC NAND | 1Gb SLC NAND parallel, 3.3V, 48-TSOP — legacy | Quote |
| K9F4G08U0F-SCB0 | SLC NAND | 4Gb SLC NAND parallel, 3.3V, 48-TSOP — legacy | Quote |
| K9GAG08U0M-PCB0 | MLC NAND | 16Gb MLC NAND parallel — legacy planar | Quote |
| KLM4G1FETE-B041 | eMMC 5.1 | 32Gb (4GB) eMMC 5.1 153-VFBGA | Quote |
| KLM8G1GETF-B041 | eMMC 5.1 | 64Gb (8GB) eMMC 5.1 153-VFBGA | Quote |
| KLMBG2JETD-B041 | eMMC 5.1 | 256Gb (32GB) eMMC 5.1 153-VFBGA | Quote |
| KLMDG4UCTA-B041 | eMMC 5.1 | 1Tb (128GB) eMMC 5.1 153-VFBGA | Quote |
| KLUEG8UHDB-C2D1 | UFS 3.1 | 256GB UFS 3.1 managed NAND 153-BGA | Quote |
| KLUFG8RHDA-B2D1 | UFS 3.1 | 512GB UFS 3.1 managed NAND 153-BGA | Quote |
| MZ-V7S1T0B/AM | 970 EVO Plus | 1TB PCIe Gen3 NVMe M.2 2280 consumer SSD | Quote |
| MZ-V8V1T0B/AM | 980 SSD | 1TB PCIe Gen3 NVMe M.2 2280 consumer SSD | Quote |
| MZ-V8P2T0B/AM | 980 PRO | 2TB PCIe Gen4 NVMe M.2 2280 consumer SSD | Quote |
| MZ-V9P2T0B/AM | 990 PRO | 2TB PCIe Gen4 NVMe M.2 2280 consumer SSD | Quote |
| MZ-V9P4T0B/AM | 990 PRO | 4TB PCIe Gen4 NVMe M.2 2280 consumer SSD | Quote |
| MZQL23T8HCLS-00A07 | PM9A3 | 3.84TB PCIe Gen4 NVMe U.2 datacenter, read-intensive | Quote |
| MZQL27T6HBLA-00A07 | PM9A3 | 7.68TB PCIe Gen4 NVMe U.2 datacenter | Quote |
| MZPLJ1T6HBJR-00007 | PM1735 | 1.6TB PCIe Gen4 HHHL mixed-use datacenter SSD | Quote |
| S25FL128SAGMFI001 | NOR flash | 128Mb SPI serial NOR flash, 3V, 16-SOIC | Quote |
| S70FL01GSAGMFV011 | NOR flash | 1Gb SPI serial NOR flash for FPGA config | Quote |
| S5KHM1SP03 | ISOCELL HM1 | 108MP CMOS image sensor, 1/1.33-inch | Quote |
| S5KGN2XX03 | ISOCELL GN2 | 50MP CMOS image sensor, 1/1.12-inch dual-pixel | Quote |
| S5K3L6XX03 | ISOCELL | 13MP CMOS image sensor, 1/3.1-inch | Quote |
| S5K2L4 | ISOCELL | 12MP CMOS image sensor, 1/2.55-inch dual-pixel | Quote |
| CL10B104KB8NNNC | SEMCO MLCC | 0603 X7R 100nF 50V 10% MLCC | Quote |
| CL21B106KOQNNNE | SEMCO MLCC | 0805 X7R 10uF 16V 10% high-cap MLCC | Quote |
| CL31A226KAHNNNE | SEMCO MLCC | 1206 X5R 22uF 25V 10% high-cap MLCC | Quote |
| CL05C100JB5NNNC | SEMCO MLCC | 0402 C0G/NP0 10pF 50V 5% RF MLCC | Quote |
| CL21B105KBFNFNE | SEMCO Auto MLCC | 0805 X7R 1uF 50V AEC-Q200 automotive MLCC | Quote |
| CIGT201210LM2R2MNE | SEMCO Inductor | 0805 shielded metal-composite 2.2uH power inductor | Quote |
| CIH10P4N7SNC | SEMCO Inductor | 0603 high-current wire-wound 4.7nH RF inductor | Quote |
| CBM322516HR300T | SEMCO Ferrite | 1210 30-ohm 3A ferrite bead EMI suppression | Quote |
Current-production Samsung HBM3 / HBM3E 12-high stacks, DDR5 MRDIMM, CXL memory expander modules, 236-layer V-NAND, next-generation Exynos SoCs, and additional temp / speed / density variants across DDR4, DDR5, LPDDR5X, and V-NAND also quoted on request. Regional revision codes and rev-locked material available — export-controlled advanced NAND and HBM subject to EAR screening.
Memory, storage, and SoC roadmaps at Samsung move quickly — components typically leave authorized distribution 2–3 years after a new process node ramps. Industrial control, medical imaging, defense electronics, avionics, and aftermarket repair channels often need continued access to legacy Samsung silicon and Samsung Electro-Mechanics passives. Hybrid Electronics sources these end-of-life Samsung products from OEM excess, contract-manufacturer surplus, and traceable secondary channels:
Send an RFQ with quantity, target date code range, and any traceability requirements (COO, MSL, factory sealed, DPAS-rated) — we return same-day availability from stock or an ETA from our sourcing network.
DDR4 and DDR5 RDIMMs (M393, M321R, M329R) for server refresh, LPDDR4X / LPDDR5 mobile DRAM (K3RG, K3LK) for embedded and industrial designs, Samsung PM9A3 and PM1735 enterprise NVMe SSDs, and 980 / 990 PRO consumer SSDs are our highest-volume Samsung quote categories. Legacy DDR3 K4B, obsolete K9F SLC NAND, discontinued Exynos SoCs, and SEMCO CL-series MLCC (including AEC-Q200 automotive Q-series) are steady low-volume sourcing lines for medical, defense, industrial, and automotive customers.
Yes — on an inquiry basis. Samsung K4ZAF-family HBM2E and HBM3 8-high and 12-high stack allocation is tight and priced dynamically, so we quote per-unit on demand against real-time supply from OEM excess and channel partners rather than holding stock. Include your target quantity, target AI accelerator platform, and required Samsung revision, and we will return an availability window and quoted price.
Yes. Samsung Electro-Mechanics is a separate Samsung Group company that operates as one of the top-three MLCC suppliers worldwide. We source SEMCO CL05, CL10, CL21, CL31, CL32 MLCC in X5R / X7R / X8R / C0G dielectrics and 0201 through 1210 case sizes, Q-series AEC-Q200 automotive MLCC, high-voltage MLCC up to 3kV, CIG / CIM / CIH power and RF inductors, CBM ferrite beads, and Wi-Fi / Bluetooth chip antenna and RF modules.
Yes. We regularly source Samsung DRAM and NAND in industrial (IT / WT) and AEC-Q100 automotive grades, plus SEMCO Q-series AEC-Q200 MLCC and passives for infotainment, ADAS, powertrain, and BMS. Ask us to match a specific temp grade, revision, or date code range on your RFQ.
Yes when available — most of our OEM-excess and CEM-surplus Samsung stock is factory sealed with original date codes and full traceability documentation. For downgraded stock we disclose condition (open tray, tested-pull, refurbished) on the quote. Customers requiring MSL data, COO, or DPAS-rated delivery should note that on the RFQ.
Same day for parts in stock — typically within 2 hours during business hours (9am–6pm ET). Sourced quotes on out-of-stock parts return within 24–48 hours with an availability window. Email sales@hybridelectronics.com or call (407) 542-3995 to open an RFQ.
No — we're an independent distributor and excess-inventory buyer sourcing from OEM excess, CEM surplus, and traceable secondary channels since 1995. For factory-warranted current-production orders, work with a Samsung-authorized distributor. For obsolete, hard-to-find, industrial-temp, or allocated Samsung Semiconductor and Samsung Electro-Mechanics parts where authorized channels show no stock, Hybrid Electronics is a proven independent source.
NEED SAMSUNG?
Send us your Samsung RFQ — part number, quantity, target date code — and we'll come back same day with availability from stock or an ETA from our sourcing network.
Or call (407) 542-3995
Hybrid Electronics is an independent distributor — not an authorized Samsung Electronics distributor. All trademarks belong to Samsung Electronics Co., Ltd. and Samsung Electro-Mechanics Co., Ltd.