Manufacturer profile
Hybrid Electronics sources Infineon power discretes, AURIX and XMC microcontrollers, PSoC and Traveo automotive MCUs, CoolSiC and CoolGaN wide-bandgap transistors, OptiMOS silicon MOSFETs, TRENCHSTOP IGBTs, EasyPACK and HybridPACK power modules, MEMS & radar sensors, OPTIGA TPM security ICs, and AIROC Wi-Fi/Bluetooth combos — plus legacy International Rectifier IRF-series MOSFETs and Cypress PSoC, SRAM, and NOR flash acquired into Infineon's portfolio. Traceable stock, factory-sealed excess, and same-day quotes since 1995.
Infineon Technologies AG, spun out of Siemens Semiconductor Group in 1999 and headquartered in Neubiberg (Munich), Germany, is the world's largest supplier of automotive semiconductors and power discretes. The company's portfolio covers power discretes (CoolSiC silicon-carbide MOSFETs, CoolGaN gallium-nitride HEMTs, OptiMOS silicon MOSFETs, TRENCHSTOP IGBTs, CoolMOS super-junction MOSFETs), power modules (EasyPACK, EconoDUAL, HybridPACK Drive traction inverter modules), automotive microcontrollers (AURIX TC3xx and TC4xx TriCore families, Traveo automotive body/chassis MCUs), industrial microcontrollers (XMC1000 and XMC4000 Arm Cortex-M), sensors (MEMS microphones, 60 GHz XENSIV radar, DPS pressure, TLI/TLE current), OPTIGA security (TPM, Trust M, authentication), and connectivity (AIROC Wi-Fi/Bluetooth combos, CIRRENT provisioning). Infineon's 2015 acquisition of International Rectifier brought the IRF, IRFP, and IR-branded power MOSFET portfolio in-house, and its 2020 acquisition of Cypress Semiconductor added PSoC 4/5/6 programmable MCUs, Traveo II, Cypress SRAM/NOR flash, and the Broadcom-origin AIROC wireless combos.
Hybrid Electronics has quoted Infineon — and its legacy IR and Cypress brands — since we opened our doors in 1995. We support customers on obsolete IRF-series and IRFP MOSFETs for locked-BOM analog and motor-drive designs, discontinued XMC1000/XMC4000 industrial MCUs for fielded automation controllers, legacy Cypress SRAM and NOR flash (CY7C, S25FL, S25FS) for FPGA boot and battery-backed logging, and allocated CoolSiC and CoolGaN wide-bandgap devices where authorized channel lead times are 30–52 weeks. When Infineon or a franchised distributor shows zero stock, we source from OEM excess, contract-manufacturer surplus, and traceable secondary channels.
Free downloads of Infineon product catalogs, short-form guides, and datasheets from Hybrid Electronics' archive.
Our line card spans Infineon's full portfolio — from newest CoolSiC G2 and AURIX TC4xx production silicon down to obsolete International Rectifier IRF-series MOSFETs and legacy Cypress PSoC 5LP still holding fielded designs together.
CoolSiC 1200 V G1 & G2 in TO-247-3/4, D2PAK-7L, TOLL and TO-263-7 packages — IMW120R045M1, IMBG120R030M1H, IMW120R045M1H, IMZ120R045M1. For 800 V EV traction, PV string inverters, ESS, EV charging, and industrial UPS.
OptiMOS 3/5/6 N-channel in DirectFET, TOLL, PQFN, D2PAK, and TO-220 — IPB017N06N3 G, BSC050N06NS3 G, IPB042N03L G, IPT007N06N. For DC/DC, brushless motor drives, telecom PSUs, and 12–60 V power stages.
CoolGaN 600 V & 700 V enhancement-mode HEMTs in DFN, TO-220, and TOLL — IGT60R070D1, IGO60R070D1. For high-density USB-PD, server, telecom rectifiers, and totem-pole PFC applications above 100 kHz.
IGBT7 / IGBT6 / IGBT4 discretes in TO-247, TO-247PLUS, TO-263 — IKW40N120CS6, IKY40N120CH7, IKW75N65EL5, IKZ50N65EH5. For welding, solar, induction heating, and industrial motor drives.
EasyPACK 1B/2B/3B, EconoDUAL 3, HybridPACK Drive and HybridPACK 2/8-DSC automotive traction inverter modules. IGBT and SiC MOSFET variants for EV inverters, wind & solar central inverters.
AURIX TC3xx 2G (TC334, TC367, TC375, TC397) and AURIX TC4xx 3G (TC49x) — multi-core TriCore with lockstep, HSM, and ISO 26262 ASIL-D. Powertrain, ADAS domain, BMS, and EV inverter control.
Arm Cortex-M0 / M4F industrial MCUs — XMC1302, XMC1404, XMC4300, XMC4400, XMC4700, XMC4800. On-chip EtherCAT, PROFINET, CAN, USB, math coprocessor for factory automation and motor control.
PSoC 6 dual-core Arm (M4 + M0+), PSoC 4 Cortex-M0/M0+, PSoC 5LP Cortex-M3 — CY8C6247BZI-D54, CY8C4245AXI-483, CY8C5888LTI. Configurable analog/digital fabric plus CapSense for HMI, medical, IoT gateways.
MEMS microphones (IM69D130, IM73A135), 60 GHz radar (BGT60TR13C, BGT60LTR11AIP), pressure (DPS310, DPS368), and current sensors (TLI4971, TLE4972). Presence detection, ANC, altimetry, and battery current monitoring.
OPTIGA TPM 2.0 (SLB 9670VQ2.0, SLB 9672, SLB 9673), OPTIGA Trust M, and OPTIGA Authenticate. TCG-certified TPM for PC, server, network, industrial, and automotive root-of-trust designs.
AIROC CYW43xxx Wi-Fi 4/5/6 + Bluetooth combos (CYW4373, CYW43439, CYW43012) and CYW20xxx Bluetooth SoCs. Raspberry Pi Pico W and Nordic-companion designs; drop-in replacements for Broadcom-branded parts.
IRF-series HEXFETs (IRF540N, IRF3205, IRF9540N, IRLB3034), IRFP-series (IRFP250N, IRFP150N, IRFP4468), IRFB / IRFR / IRFZ, and IRLZ44 logic-level. Locked-BOM sourcing for audio, motor drive, DC-DC, and solar MPPT designs.
Async and synchronous SRAM CY7C10xx / CY62xx / CY14xx nvSRAM, Semper NOR and S25FL / S25FS serial NOR — CY7C1041G30-10ZSXI, S25FL256L, S25FS512S. For FPGA boot, telecom line cards, industrial data logging, and automotive body electronics.
Hybrid Electronics quotes and sources the following Infineon parts across power, automotive, industrial, security, and sensor segments. Infineon uses IPB/IPT/BSC/BSZ prefixes for OptiMOS silicon MOSFETs, IMW/IMBG/IMZ for CoolSiC, IGT/IGO for CoolGaN, IKW/IKY/IKZ for TRENCHSTOP IGBTs, TC for AURIX, XMC for industrial MCUs, CY8C/CY7C/S25 for Cypress legacy, and IRF/IRFP for International Rectifier legacy — contact us for the exact ordering part number, package suffix, and revision you need.
| Part number | Family | Description | Quote |
|---|---|---|---|
| IPB017N06N3 G | OptiMOS 3 | 60V N-channel MOSFET, 1.7 mΩ, D2PAK | Quote |
| BSC050N06NS3 G | OptiMOS 3 | 60V N-channel MOSFET, 5 mΩ, SuperSO8 | Quote |
| IPB042N03L G | OptiMOS-T2 | 30V logic-level N-channel MOSFET, 4.2 mΩ, D2PAK | Quote |
| IPT007N06N | OptiMOS 5 | 60V N-channel MOSFET, 0.75 mΩ, TOLL | Quote |
| IMW120R045M1 | CoolSiC G1 | 1200V SiC Trench MOSFET, 45 mΩ, TO-247-3 | Quote |
| IMW120R045M1H | CoolSiC G1 | 1200V SiC Trench MOSFET, 45 mΩ, TO-247-3 .XT | Quote |
| IMBG120R030M1H | CoolSiC G1 | 1200V SiC Trench MOSFET, 30 mΩ, D2PAK-7L .XT | Quote |
| IMZ120R045M1 | CoolSiC G1 | 1200V SiC Trench MOSFET, 45 mΩ, TO-247-4 Kelvin | Quote |
| IGT60R070D1 | CoolGaN | 600V GaN HEMT, 70 mΩ, DFN 8×8, enhancement-mode | Quote |
| IGO60R070D1 | CoolGaN | 600V GaN HEMT, 70 mΩ, TOLL package | Quote |
| IKW40N120CS6 | TRENCHSTOP IGBT6 | 1200V 40A IGBT + rapid-1 diode, TO-247-3 | Quote |
| IKY40N120CH7 | TRENCHSTOP IGBT7 | 1200V 40A IGBT7, high-speed, TO-247PLUS Kelvin | Quote |
| TC397XM-96F300N BC | AURIX 2G TC3xx | Hex-core TriCore, 16MB flash, ASIL-D, LFBGA-292 | Quote |
| TC375TP-96F300N BC | AURIX 2G TC3xx | Tri-core TriCore, 6MB flash, ASIL-D, LQFP-176 | Quote |
| XMC1302-Q040X0064 AB | XMC1000 | Cortex-M0 industrial MCU, 64KB flash, VQFN-40 | Quote |
| XMC4700-F144K2048 AA | XMC4000 | Cortex-M4F 144 MHz, 2MB flash, LQFP-144, EtherCAT | Quote |
| CY8C6247BZI-D54 | PSoC 6 (Cypress) | Dual-core Arm M4 + M0+, 1MB flash, BLE, BGA-124 | Quote |
| CY8C4245AXI-483 | PSoC 4 (Cypress) | Cortex-M0 48 MHz, 32KB flash, CapSense, TQFP-44 | Quote |
| SLB 9670VQ2.0 | OPTIGA TPM | TPM 2.0, SPI, TCG certified, TSSOP-28 | Quote |
| BGT60TR13C | XENSIV radar | 60 GHz FMCW radar sensor, 1Tx/3Rx, QFN-48 | Quote |
| DPS310 | XENSIV pressure | Barometric pressure & temp sensor, ±0.005 hPa, LGA-8 | Quote |
| IM69D130 | XENSIV MEMS mic | Digital MEMS microphone, 105 dB SNR, PDM output | Quote |
| CYW4373EUBGT | AIROC Wi-Fi/BT | Wi-Fi 5 + Bluetooth 5.2 combo SoC, FCBGA-56 — Cypress legacy | Quote |
| IRF540NPBF | IR legacy HEXFET | 100V N-channel MOSFET, 33A, TO-220AB — International Rectifier | Quote |
| IRF3205PBF | IR legacy HEXFET | 55V N-channel MOSFET, 110A, TO-220AB — International Rectifier | Quote |
| IRFP250N | IR legacy HEXFET | 200V N-channel MOSFET, 30A, TO-247AC — International Rectifier | Quote |
| CY7C1041G30-10ZSXI | Cypress SRAM | 4Mb async SRAM, 10 ns, 3.3V, TSOP-II — Cypress legacy | Quote |
| S25FL256LAGMFI010 | Cypress Serial NOR | 256Mb 1.8V Quad SPI NOR flash, WSON-8 — Cypress legacy | Quote |
HybridPACK Drive and HybridPACK 8-DSC automotive traction modules, EasyPACK and EconoDUAL industrial IGBT modules, AURIX TC4xx TC49x samples, CoolSiC G2 (IMBGxxxR030M2H, IMWxxxR030M2H), Traveo II automotive body/chassis MCUs, and OPTIGA Trust M ICs also quoted on request. Ordering part numbers include tape-and-reel and tube suffixes (T, XKSA1, XUMA1) — specify packing and date-code range on your RFQ.
Infineon's portfolio spans three merged brands (Infineon + International Rectifier + Cypress), and each has a long tail of end-of-life parts still needed by systems in defense, medical, automotive, and industrial automation. Hybrid Electronics sources these legacy Infineon products from OEM excess, contract-manufacturer surplus, and traceable secondary channels:
Send an RFQ with quantity, target date code range, and any traceability requirements (COO, MSL, factory sealed, AECQ) — we return same-day availability from stock or an ETA from our sourcing network.
Automotive AURIX TC3xx microcontrollers (TC375, TC397), CoolSiC 1200 V MOSFETs for EV and PV inverters, OptiMOS silicon MOSFETs, and legacy International Rectifier IRF-series HEXFETs are our highest-volume Infineon categories. Cypress PSoC 6 and PSoC 4, XMC4000 industrial MCUs, and OPTIGA TPM chips are steady mid-volume sourcing lines for medical, industrial, and IoT customers.
Yes — on an inquiry basis. CoolSiC 1200 V and AURIX 2G/3G allocation is tight, with authorized-channel lead times running 30–52 weeks in 2026. We quote per-unit on demand against real-time OEM-excess supply and channel partner stock rather than holding it. Include your target quantity, package option (TO-247-3, TO-247-4, D2PAK-7L, TOLL for CoolSiC; LQFP-176, LFBGA-292 for AURIX), and required date-code range, and we'll return an availability window and firm quote.
Yes — both brands are core to what we do. Infineon acquired International Rectifier in 2015 and Cypress Semiconductor in 2020, and much of the IRF, IRFP, IRLZ, PSoC, CY7C SRAM, and S25FL NOR portfolio is still in production or in extended last-time-buy phases. For designs locked to IR-branded or Cypress-branded packaging and markings, we source factory-sealed original inventory from OEM excess and traceable secondary channels — not repackaged or remarked parts.
Yes when available — most of our OEM-excess and CEM-surplus Infineon, IR, and Cypress stock is factory sealed with original date codes, moisture-barrier bags, and full traceability documentation. For downgraded stock we disclose condition (open box, tested-pull, refurbished) on the quote. Customers needing MSL data, COO, DPAS-rated delivery, AEC-Q100/Q101 grade confirmation, or PPAP-level documentation should note that on the RFQ.
Same day for parts in stock — typically within 2 hours during business hours (9am–6pm ET). Sourced quotes on out-of-stock or allocated parts (CoolSiC, AURIX 2G, HybridPACK Drive modules) return within 24–48 hours with an availability window. Email sales@hybridelectronics.com or call (407) 542-3995 to open an RFQ.
No — we're an independent distributor and excess-inventory buyer sourcing from OEM excess, CEM surplus, and traceable secondary channels since 1995. For factory-warranted current-production orders on Infineon, IR, or Cypress parts, work with an Infineon-franchised distributor. For obsolete, allocated, hard-to-find, or urgent line-down parts where authorized channels show zero stock or 40+ week lead times, Hybrid Electronics is a proven independent source.
NEED INFINEON?
Send us your Infineon, International Rectifier, or Cypress RFQ — part number, quantity, target date code — and we'll come back same day with availability from stock or an ETA from our sourcing network.
Or call (407) 542-3995
Hybrid Electronics is an independent distributor — not an authorized Infineon Technologies distributor. All trademarks belong to Infineon Technologies AG.