Manufacturer profile
Hybrid Electronics sources Aavid Thermalloy — now the Aavid Thermal Division of Boyd Corporation — board-level extruded, bonded-fin and pin-fin heat sinks (HS-, MAXICOOL, BGA-STAR, MAX-CLIP-PIN), TO-220 / TO-247 / TO-3P clip-mount and PCB-mount heat sinks (507002B00000G, 590302B03400G, 511702B00000G, 375024B00000G, 375124B00000G), MAXILED LED cooling assemblies, Thermacore heat pipes and vapor chambers, Aavid Genie (Nuventix Synjet) piezo coolers, Boyd machined and friction-stir-welded liquid cold plates (BoydCP series), thermoelectric (Peltier) coolers, MicroTherm fans and blowers, KerAtherm thermal interface materials, and Boyd EMI shielding gaskets and custom fabricated products — spanning current Aavid / Boyd production through pre-2016 Aavid direct, pre-1997 Thermalloy extruded stock, Thermacore heritage heat pipes and Nuventix Synjet lot codes still specified into locked-BOM industrial power, LED, medical, telecom, aerospace and defense builds. Same-day quotes and traceable OEM-excess sourcing since 1995.
Aavid Thermalloy's roots run back to 1964, when Aavid Engineering was founded in Concord, New Hampshire to produce extruded aluminum heat sinks for the emerging semiconductor industry. Thermalloy — founded separately in Dallas, Texas — competed alongside Aavid through the 1970s and 1980s in board-level and TO-package cooling. In 1997 the two companies merged to form Aavid Thermalloy, consolidating the largest independent thermal management catalog in North America. In 2010, Aavid Thermalloy was acquired by Audax Group private equity and split from its former parent Applied Precision. In 2016, Aavid Thermalloy was sold to Boyd Corporation (headquartered in Pleasanton, California) and rebranded as the "Aavid Thermal Division of Boyd Corporation." In 2018, Boyd Corporation was acquired by Goldman Sachs Merchant Banking, which remains the current majority owner.
The modern Aavid / Boyd catalog is a rollup of multiple acquisitions, so it helps buyers to trace them. The original Aavid (1964) line brought extruded aluminum board-level heat sinks (the HS series), TO-220 / TO-247 clip-mount cooling (507002 / 590302 / 511702 / 375024 / 375124 part numbers), and pin-fin BGA cooling (MAX-CLIP-PIN, MAXICOOL, BGA-STAR). Thermalloy (pre-1997) added extruded and stamped heat sinks and mounting hardware. Aavid Nuventix (2015) contributed Synjet piezoelectric active-cooling modules — later rebranded Aavid Genie — for LED, telecom and rugged embedded applications. Aavid Thermacore (2016, arriving through Boyd) brought the Thermacore heritage of sintered copper heat pipes, vapor chambers, loop heat pipes and two-phase cooling loops used in aerospace, defense, data-center and high-power industrial builds. Boyd Corporation already had a large parent portfolio in fabricated products (RSL), gasketing, KerAtherm thermal interface materials, EMI shielding, liquid cold plates (machined and friction-stir-welded BoydCP series), and custom liquid loops for EV battery and data-center immersion cooling. Under Goldman Sachs ownership since 2018 the combined group markets the entire stack — passive, active, two-phase, liquid, TEC, TIM and EMI — as Boyd, with the Aavid Thermal Division continuing the historical Aavid Thermalloy heat-sink and heat-pipe catalog.
Hybrid Electronics has channeled legacy and excess Aavid / Thermalloy / Thermacore / Nuventix / Boyd product since 1995. We support locked-BOM industrial, medical, telecom, defense, aerospace and LED-lighting customers who need continued access to pre-1997 pre-merger Aavid extruded and Thermalloy stamped stock, pre-Boyd 2016 direct Aavid part numbers that changed distribution and lot marking after the rebrand, obsolete Nuventix Synjet module lot codes, older MAXICOOL revisions, pre-Thermacore heat-pipe wick constructions, discontinued MAXILED PAR30 / PAR38 luminaire assemblies, older 507002 TO-220 anodized finishes, pre-Goldman Sachs 2018 Boyd branding on cold plates and KerAtherm lots, alongside current-production Aavid Genie piezo, Thermacore-heritage vapor chambers, BoydCP friction-stir-welded liquid cold plates, TEC modules, MicroTherm fans and KerAtherm TIMs when authorized channels show extended lead times.
Our line card covers the merged Aavid / Thermalloy / Thermacore / Nuventix / Boyd portfolio — extruded, bonded-fin and pin-fin board-level heat sinks, TO-220 / TO-247 clip-mount cooling, LED heat sinks, attach hardware, heat pipes, vapor chambers, machined and friction-stir-welded liquid cold plates, thermoelectric coolers, fans and blowers, thermal interface materials, custom liquid cooling loops and Boyd EMI shielding.
BGA-STAR and MAXICOOL series bonded-fin heat sinks for high-power BGA, QFN, and TO-220 packages. Aluminum extruded base with epoxy-bonded fins for maximum surface area in tight board pitch. Push-pin, clip and thermal-tape attach options.
HS-series rectangular extruded aluminum heat sinks (HS-192, HS-247, HS-501, etc.) cut to custom length. The original Aavid 1964 catalog — used for linear regulators, power ICs, DC-DC bricks, and general board-level thermal design.
MAX-CLIP-PIN and Universal Pin Fin omnidirectional pin-fin extrusions for BGA and FCBGA processors. Cold-forged aluminum pin arrays for high effectiveness in low-airflow chassis and natural-convection industrial builds.
507002B00000G, 590302B03400G, 511702B00000G, 375024B00000G (TO-220), 375124B00000G (TO-247), plus the wider HSTOxxx vertical mount family. Anodized aluminum with tab-mount, clip-mount and PCB-mount options.
MAXILED extruded round and star heat sinks, PAR30 / PAR38 style luminaire assemblies, and Xicato / Bridgelux / Cree COB-array plate coolers used in retrofit lamps, high-bay, street-lighting and horticultural LED fixtures.
Star clip, Push-pin, screw-and-spring, and thermal-tape attach kits sized for TO-220, TO-247, D2PAK, BGA and QFN packages. Legacy Thermalloy stamped clips still sourced from OEM excess for locked-BOM builds.
Standard OD 3mm / 4mm / 5mm / 6mm / 8mm sintered copper heat pipes, plus groove-wick and mesh-wick constructions. Water-charged copper envelope, custom bend and flatten profiles for laptop, industrial PC, medical imaging and defense cooling.
Sintered copper wick vapor chambers for CPU / GPU / ASIC / laser diode cooling. High effective thermal conductivity for heat-spreading under high-density BGA packages and RF power amplifiers in data-center and defense builds.
BoydCP series machined aluminum and copper liquid cold plates with press-fit copper tube or gun-drilled channels. Standard footprints for IGBT / SiC / GaN power modules, EV battery packs and RF power amplifiers.
Vacuum-brazed and friction-stir-welded (FSW) high-performance liquid cold plates for high-power inverter, traction motor drive, DC fast-charging and laser cooling. Bonded-fin internal geometry for maximum heat flux density.
T-series single-stage and multi-stage bismuth telluride Peltier modules — including UT8 and UT15 single-stage families — for laser diode temperature control, medical / analytical instrumentation, telecom optics and precision sensor cooling.
Aavid MicroTherm axial fans and centrifugal blowers for compact chassis, plus Aavid Genie / Nuventix Synjet piezoelectric active-cooling modules for LED downlight and rugged embedded applications where a traditional fan cannot survive.
Boyd KerAtherm ceramic-filled thermal pads and gap fillers, phase-change materials, graphite sheets, and Aavid Thermalcote / Thermalbond grease and adhesive. Sourced across current lot and legacy pre-Boyd 2016 KerAtherm codes.
Complete pumped single-phase and two-phase liquid loops for EV battery cold plates, data-center immersion, laser and medical imaging cooling. Integrated pump, reservoir, cold plate, quick disconnect and heat exchanger assemblies.
Boyd Corp fabric-over-foam, conductive elastomer, beryllium copper finger stock and knitted-wire EMI gaskets, board-level shield cans and thermal-EMI hybrids — sourced alongside Aavid heat-sink assemblies for enclosure-level design.
Boyd Fabricated Products / RSL heritage stamped, die-cut and CNC-machined thermal brackets, chassis, EMI cans, custom-cut TIM pre-forms and integrated thermal-mechanical assemblies for OEM programs.
Discontinued Nuventix Synjet LED cooler lot codes, pre-1997 pre-merger Aavid and Thermalloy extruded and stamped part numbers, obsolete MAXILED PAR30 / PAR38 revisions, and older 507002 TO-220 anodized finish variants — long obsolete but still sourced from OEM excess for locked-BOM industrial and defense systems.
Hybrid Electronics quotes and sources the following Aavid Thermalloy / Boyd parts across board-level extruded, bonded-fin and pin-fin heat sinks, TO-220 / TO-247 / TO-3P clip-mount cooling, LED heat sinks, attach hardware, Thermacore heat pipes and vapor chambers, BoydCP machined and friction-stir-welded liquid cold plates, thermoelectric coolers, Aavid MicroTherm fans, Aavid Genie / Nuventix Synjet piezo coolers, KerAtherm thermal interface materials, and Boyd EMI shielding. Aavid uses catalog prefixes such as 507002 / 590302 / 511702 / 375024 / 375124 for TO-package heat sinks, HS- for extruded profiles, MAXICOOL / BGA-STAR / MAX-CLIP-PIN for board-level bonded-fin and pin-fin, MAXILED for LED cooling, T-CO / UT8 / UT15 for thermoelectric modules, and BoydCP for liquid cold plates. Contact us for exact profile length, finish, extrusion revision, and packaging you need.
| Part number | Family | Description | Quote |
|---|---|---|---|
| 507002B00000G | TO-220 heat sink | Vertical PCB-mount TO-220 heat sink, black anodized aluminum, 12.7mm profile | Quote |
| 590302B03400G | TO-220 heat sink | Horizontal PCB-mount TO-220 heat sink with tab-clip, black anodized | Quote |
| 511702B00000G | TO-220 heat sink | Low-profile PCB-mount TO-220 heat sink, aluminum, natural finish | Quote |
| 375024B00000G | TO-220 clip-mount | Vertical clip-mount TO-220 heat sink, extruded aluminum, black anodized | Quote |
| 375124B00000G | TO-247 clip-mount | Vertical clip-mount TO-247 heat sink, extruded aluminum, black anodized | Quote |
| 577202B00000G | TO-220 vertical sink | Vertical PCB-mount TO-220 heat sink, medium profile, black anodized | Quote |
| 513002B00000G | TO-220 PCB sink | Low-cost stamped TO-220 heat sink, PCB mount, natural aluminum | Quote |
| 6398BG | TO-3 heat sink | TO-3 flanged transistor heat sink, extruded aluminum, black anodized | Quote |
| HS-192-30 | Extruded HS profile | HS-192 rectangular extruded heat sink, 30mm cut length, natural aluminum | Quote |
| HS-247-50 | Extruded HS profile | HS-247 rectangular extruded heat sink, 50mm cut length, black anodized | Quote |
| HS-501-75 | Extruded HS profile | HS-501 rectangular extruded heat sink, 75mm cut length, natural aluminum | Quote |
| HS-105-100 | Extruded HS profile | HS-105 board-level extruded heat sink, 100mm cut, black anodized | Quote |
| HSTO220-C1 | TO-220 vertical sink | HSTO series vertical TO-220 heat sink, clip attach, natural aluminum | Quote |
| HSTO247-C2 | TO-247 vertical sink | HSTO series vertical TO-247 heat sink, clip attach, black anodized | Quote |
| MAX-CLIP-PIN-15 | Pin-fin BGA sink | Omnidirectional pin-fin BGA heat sink, 15mm profile, spring-clip attach | Quote |
| MAX-CLIP-PIN-25 | Pin-fin BGA sink | Omnidirectional pin-fin BGA heat sink, 25mm profile, spring-clip attach | Quote |
| MAX-CLIP-PIN-35 | Pin-fin BGA sink | Omnidirectional pin-fin BGA heat sink, 35mm profile, spring-clip attach | Quote |
| MAXICOOL-27-27-10 | Bonded-fin BGA sink | 27x27mm bonded-fin BGA heat sink, 10mm profile, epoxy-bonded aluminum fins | Quote |
| MAXICOOL-45-45-15 | Bonded-fin BGA sink | 45x45mm bonded-fin BGA/FCBGA heat sink, 15mm profile, push-pin attach | Quote |
| MAXICOOL-60-60-25 | Bonded-fin sink | 60x60mm bonded-fin heat sink, 25mm profile, thermal-tape attach | Quote |
| BGA-STAR-STD-27 | Bonded-fin BGA sink | BGA-STAR standard 27x27mm bonded-fin heat sink for FCBGA processors | Quote |
| BGA-STAR-HP-40 | Bonded-fin BGA sink | BGA-STAR high-performance 40x40mm bonded-fin heat sink, aluminum | Quote |
| MAXILED-3-25-BW | LED heat sink | MAXILED round star-fin LED heat sink, 25mm dia, bright-white anodize | Quote |
| MAXILED-5-40-BK | LED heat sink | MAXILED round star-fin LED heat sink, 40mm dia, 5-fin, black anodized | Quote |
| MAXILED-PAR30-BK | PAR30 LED sink | PAR30 luminaire LED heat sink assembly, extruded aluminum, black | Quote |
| MAXILED-PAR38-NA | PAR38 LED sink | PAR38 luminaire LED heat sink assembly, cold-forged aluminum, natural | Quote |
| STAR-CLIP-TO220 | Attach hardware | Star-clip TO-220 attach spring clip, stainless steel, universal fit | Quote |
| PUSHPIN-BGA-2S | Attach hardware | Universal push-pin heat sink attach set, 2-piece plastic + spring, BGA | Quote |
| HP-SC-3-150-C | Heat pipe — sintered | 3mm OD sintered copper heat pipe, 150mm length, round | Quote |
| HP-SC-4-200-C | Heat pipe — sintered | 4mm OD sintered copper heat pipe, 200mm length, round profile | Quote |
| HP-SC-5-250-F | Heat pipe — flattened | 5mm OD sintered copper heat pipe, 250mm, flattened to 2.5mm | Quote |
| HP-SC-6-300-C | Heat pipe — sintered | 6mm OD sintered copper heat pipe, 300mm length, round | Quote |
| HP-SC-8-400-C | Heat pipe — sintered | 8mm OD sintered copper heat pipe, 400mm length, round profile | Quote |
| HP-GR-6-250-C | Heat pipe — groove wick | 6mm OD groove-wick copper heat pipe, 250mm, round — for 1G environments | Quote |
| VC-TC-80-80-3 | Vapor chamber | Thermacore vapor chamber, 80x80mm, 3mm thick, sintered copper wick | Quote |
| VC-TC-120-120-4 | Vapor chamber | Thermacore vapor chamber, 120x120mm, 4mm thick — for GPU / ASIC spreading | Quote |
| BoydCP-100-050 | Cold plate — machined | Machined aluminum liquid cold plate, 100x50mm, press-fit copper tube | Quote |
| BoydCP-150-100 | Cold plate — machined | Machined aluminum liquid cold plate, 150x100mm, gun-drilled channels | Quote |
| BoydCP-FSW-200-150 | Cold plate — FSW | Friction-stir-welded aluminum cold plate, 200x150mm, bonded-fin internal | Quote |
| BoydCP-BR-250-200 | Cold plate — brazed | Vacuum-brazed aluminum liquid cold plate, 250x200mm, high heat flux | Quote |
| T-CO-1400 | Thermoelectric cooler | Boyd Genie T-series single-stage TEC / Peltier module, 14A max, 40mm | Quote |
| UT8-12-40-F1 | Thermoelectric cooler | UT8 single-stage TEC module, 8.5A, 12V, 40x40mm — laser diode cooling | Quote |
| UT15-30-30-F2 | Thermoelectric cooler | UT15 single-stage TEC module, 15A, 30x30mm — analytical instrumentation | Quote |
| MICROTHERM-40-24V | Axial fan | Aavid MicroTherm 40mm axial fan, 24VDC, ball-bearing, PWM control | Quote |
| MICROTHERM-60-12V | Axial fan | Aavid MicroTherm 60mm axial fan, 12VDC, ball-bearing, industrial temp | Quote |
| MICROTHERM-BL-40-24V | Blower | Aavid MicroTherm 40mm centrifugal blower, 24VDC — compact chassis | Quote |
| GENIE-SJ-40-LED | Piezo cooler — Genie | Aavid Genie / Nuventix Synjet piezoelectric LED cooler module, 40mm | Quote |
| KA-PAD-86-100-025 | TIM — KerAtherm pad | KerAtherm thermal pad, 8.6 W/mK, 100x100mm, 0.25mm thickness | Quote |
| KA-PAD-30-200-050 | TIM — KerAtherm pad | KerAtherm gap filler pad, 3.0 W/mK, 200x200mm, 0.5mm — battery packs | Quote |
| TB-COTE-PHASE-C50 | TIM — phase change | Aavid Thermalcote phase-change TIM, C50 grade, 100x100mm sheet | Quote |
| EMI-FOF-8-500 | EMI — fabric-over-foam | Boyd fabric-over-foam EMI gasket, 8mm x 500mm roll, conductive | Quote |
| EMI-BeCu-FS-10-1000 | EMI — BeCu finger stock | Beryllium copper EMI finger stock, 10mm profile, 1000mm strip | Quote |
| NUVENTIX-SJ-40-LED-LEGACY | Legacy Synjet | Legacy Nuventix Synjet piezoelectric LED cooler — pre-Aavid Genie lot codes | Quote |
| TL-STAMP-C1-LEGACY | Legacy Thermalloy clip | Pre-1997 Thermalloy stamped TO-220 heat sink clip — locked-BOM industrial | Quote |
| HS-PRE97-192-30 | Pre-merger Aavid HS | Pre-1997 pre-merger Aavid HS-192 extruded profile, 30mm — legacy stock | Quote |
Additional cut lengths, anodize finishes (natural / black / clear / bright-white), extrusion revisions, and packaging variants across HS-, HSTO-, MAXICOOL, BGA-STAR, MAX-CLIP-PIN, MAXILED, and BoydCP families also quoted on request. Aavid Thermacore heritage heat pipes and vapor chambers sourced with wick construction and charge-fluid documentation. Pre-Boyd 2016 Aavid direct, pre-1997 Thermalloy stamped, and Nuventix Synjet legacy lot codes handled from OEM excess with lot / date-code traceability.
Aavid Thermalloy has rolled through four ownership changes — Applied Precision, Audax Group PE, Boyd Corporation, and Goldman Sachs Merchant Banking — and absorbed Thermacore, Nuventix, and Boyd's own fabricated-products and KerAtherm heritage. Long-lifecycle industrial power, LED-lighting, medical, telecom, aerospace and defense builds still specify these legacy families. Hybrid Electronics sources them from OEM excess, CEM surplus, and traceable secondary channels:
No — we're an independent distributor and excess-inventory buyer sourcing from OEM excess, CEM surplus, and traceable secondary channels since 1995.
Yes. TO-220, TO-247 and TO-3P clip-mount and PCB-mount heat sinks — 507002B00000G, 590302B03400G, 511702B00000G, 375024B00000G, 375124B00000G, 577202B00000G and the HSTO-series vertical mount families — are core Aavid catalog and one of our most-quoted lines. We source them across black-anodized, natural aluminum and legacy pre-Boyd 2016 finishes with full lot and date-code traceability.
Yes — the Aavid / Boyd heat pipe and vapor chamber catalog descends from the Thermacore heritage absorbed through Boyd. We routinely quote standard 3mm, 4mm, 5mm, 6mm and 8mm OD sintered copper heat pipes, flattened variants for laptop and industrial-PC cooling, groove-wick pipes for 1G orientations, and Thermacore-heritage sintered copper vapor chambers for CPU / GPU / ASIC and RF power spreading — many with custom bend, flatten and length profiles.
Yes. Aavid Genie modules (Nuventix Synjet heritage) and legacy Nuventix-branded Synjet piezoelectric active-cooling modules for LED downlight, retrofit lamps and rugged embedded builds are all in our line card. We source current-lot Boyd Aavid Genie and legacy Nuventix Synjet part numbers where locked-BOM builds still specify the original marking.
Yes. Machined, vacuum-brazed and friction-stir-welded BoydCP liquid cold plates (BoydCP-100-050, BoydCP-150-100, BoydCP-FSW-200-150, BoydCP-BR-250-200) for IGBT / SiC / GaN power modules, EV battery packs and laser cooling — plus KerAtherm ceramic-filled thermal pads and gap fillers across current and pre-2018 lot codes — are quoted from OEM excess with lot traceability.
We routinely source pre-1997 pre-merger Aavid extruded HS-series and pre-1997 Thermalloy stamped clips, pre-Boyd 2016 direct 507002 / 590302 / 511702 / 375024 / 375124 finishes, obsolete Nuventix Synjet lot codes, older MAXICOOL bonded-fin revisions, discontinued MAXILED PAR30 / PAR38 luminaire assemblies, pre-Thermacore heat-pipe wick constructions, pre-Goldman Sachs 2018 Boyd-branded cold plates and KerAtherm TIM lots, and pre-Audax 2010 Applied Precision-parent Aavid stock — all with OEM-excess traceability where documentation exists.
Call (407) 542-3995 or submit an RFQ — we cover current Boyd / Aavid production plus obsolete pre-1997 Aavid / Thermalloy, pre-Boyd 2016 direct part finishes, Nuventix Synjet lot codes, MAXILED PAR30 / PAR38, and pre-Goldman Sachs 2018 Boyd branding with OEM-excess traceability since 1995.